About ShunYun
Group of Companies
ShunYun Technology is a subsidiary of Shunsin Group,
and has been focusing on the manufacturing of optical transceiver modules since 1991.
We currently have investment and manufacturing plants in
Hanoi City and Bac Giang City in Vietnam, Zhongshan City in China, and have a branch office in Taiwan.
ShunYun Technology was spun off from the Optical Business Unit of the publicly listed Shunsin Technology. As a company dedicated to optical transceiver production, it operates three campuses located in Zhongshan (China), Hanoi (Vietnam), and Bac Giang (Vietnam). With deep expertise in optical transceivers, CPO, and optical engines, the ShunYun team has accumulated over 30 years of product development and high-volume manufacturing experience. It has grown into a world-class optical transceiver manufacturer. Leveraging long-term technological accumulation, reliable product quality, and a robust supply chain, the company has earned product certifications from many internationally recognized enterprises.
ShunYun will continue to strengthen its investment in optical module technologies, including CPO, Silicon Photonic Transceivers, Coherent Transceivers, Optical Engines, Optical I/O, Gold-Box TOSA, PIC DPS, COC, CoWoS, WSS, EDFA, WDM, and ROADM, striving to provide customers with superior products and services.
The company possesses advanced semiconductor packaging technologies and strong semiconductor R&D capabilities. It operates high-class cleanrooms and utilizes world-leading manufacturing equipment to research and develop optical communication products. Its technology portfolio covers Wafer Bumping/RDL, Wafer AOI, Wafer Grinding, Chip on Wafer, Grating Couple/Edge Couple Wafer Probing, Wafer Stealth Dicing, Die Sorting & Six-Side Inspection, Fine-Pitch Flip-Chip (with or without pre-solder pads), Thermal Compression Bonding for Chip-on-Chip/Substrate, Flux-less Flip-Chip, Fine-Gap Underfill, Wafer-Level Ball Mount, Wafer-Level GC Active Alignment, Dual-Lens Coupling, and fully automated module assembly—all at industry-leading levels.
With production capabilities spanning two countries and three locations, ShunYun provides highly flexible customer support. Its customer base extends across the Americas, Asia, and Europe, making it a key strategic partner for many globally renowned companies.
Multiple Operation Sites
Serve Application Market
DataCOM/AI
- CPO 51.2T/102.4T
- Optic I/O
- Pluggable XCVR 400G/800G/1.6T
TeleCOM
- CPO 51.2T/102.4T
- Optic I/O
- Pluggable XCVR 400G/800G/1.6T
We Offer One Stop Solution
- Copper Pillar Bumping
- Solder Bumping
- RDL Q3’2026 Ready
- SiPh Wafer Probing
- Stealth Dicing
- Chip on Wafer
- Die Attach,Wire Bond
- 3D Die Stacking (TCB)
- Active Alignment (AA)
- Forming and Splicing
- Module Test
Electric Power Supply Solution
Why ShunYun ?
Scalability
- Qualified by Tier1 customers
- Well-established quality management and supplier audit system
- Well-established quality management and supplier audit system
Stability
- Qualified by Tier1 customers
- Well-established quality management and supplier audit system.
- Over 30 years intensive experience in OSAT & optical transceiver module manufacturing
Capability
- Specialized in optical transceiver, silicon photonics, wafer level service and high-speed PCB/PCBA assembly. (SMT 008004)
- Customized service: SiPhotonics, 3D package, Stealth Dicing, CoW
- Fast ramp up capability with high yield
Flexibility
- Multiple regions/ sites operation
- Vietnam – HaNoi site, Quang Chau site / China – Zhongshan site
- Customized service: SiPhotonics, 3D package, Stealth Dicing, CoW
- Supported by Foxconn’s vertically integrated supply chain for fast project ramp-up