Function Test

• Support module test for 10G and above
• Test Temp： -20°C、 0°C、 70°C
• Test Parameters： LOP, Eye Mask, ER, LIP, Sensitivity, LOSA, LOSD etc.
• Product Types: SFP,QSFP,CXP,CXPAOC,CFP2 etc.

Burn In Test

• Full load 3.3K PCBA per machine
• Voltage:5V supply to Test Board
• BI duration:3~8days
• Typical temperature:75~85 degree
• Support maximum current 160A per PSU

• Temp Cycles（- 40°C ~ 85°C , 15cycles）

Label AOI

• Pull tab check, Dust Cap check, Screw, Spring, Housing damage check
• Label contents, 1D/2D barcode, character, logo, SN format check
• Save test results and photos
• High UPH

LC Port Inspection

• Auto focusing and Test
• Auto cleaning once test failed
• Generate test report and upload to database
• High UPH
• Low touch