Wafer Backend Process
- Wafer backgrinding process capability
- Wafer size：8inch, 12inch
- Final thickness: min. 50um
- Tolerance：±10um
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- Wafer dicing saw process capability
- Provide different size vacuum chuck table
- DI water with CO2 and diamaflow to avoid ESD and contamination issue.
- Provide various dicing blade and optimal process solution according to different wafer material (Si, COMS, LiTaO3, glass, etc.)
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- Dice tape & Reel process capability
- Six side AOI (Missing bump, crack, chipping, contamination, etc.)
- UPH:12~14k
- Min. dice size:0.3*0.3mm
- Dice type: Si, SiGe, GaAs
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Address:A part of Land Lot H, Quang Chau Industrial Park, Nenh Town, Viet Yen District, Bac Giang Province, Vietnam. TEL:+84-24-32095591
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