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- Mount process capability
- Fine pitch copper pillar and CSP flip chip
- 25um high precision mount location auto adjusting.
- High precision mount pressure control.
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- Reflow process capability
- Max. 13 heated zone
- Accuracy of temp. controller: +/-0.1℃
- Temp. tolerance: +/-2℃
- Temp. range: 25c~350℃
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- AOI process capability
- High efficiency auto optical inspection; 100% AOI, include missing component, tombstone, PIN 1 error, shift, short, contamination, etc.
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- XRay process capability
- Resolution: <0.5um
- Max sample dimensions: 736*580mm
- Max 70° inspect angle
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- Aqua clean process capability
- Six clean zone
- Max clean water pressure: 80PSI
- MMax water Temp. : 70℃
- Can use saponifiers
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- SPI process capability
- XY resolution: 1um
- Height resolution: 0.37um
- Smallest Size measurement: 150um
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