Thermo Compression Bonding
- Thermo Compression Bonding Process Capability
- Process：TCNCP /TCCUF / TCNCF
- Die Size : 2 to 20mm
- Die Thickness︰50 to 1100um
- Bond Head Heating Range：26~400℃
- Bond Head Heating Rate：350℃/s
- Bond Head Cooling Rate：140℃/s
- Bond Force Range：3 ~ 300N
- Bond Force Accuracy：±2N or ±2%
- Alignment Accuracy：XY : +/-2um 3sigma, Theta: +/-0.025°
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