Product Services
Assembly Service
->Assembly Capability
． Wafer Process
． SMT Process
． Front-End Process
． Active Align
． Laser Depanel
． Hermetic & Sealing
． Thermo Compression Bonding
． Ball Mounting
->RA & FA
Testing Service
->Test Overview
->Test Capability
Information Service
IP Protection
Supply Chain
NPI Service and Capability
In-House Automation
 
Process Roadmap
2025
2026
2027
Wafer Grinding
Process Roadmap
Min. Wafer Thickness
50 um
30 um
30 um
Wafer Size
8/ 12 inches
6/8/12 inches
30 um
Wafer Dicing
Process Roadmap
Dicing Accuracy
± 5um
± 3 um
± 3 um
Blade width
35 um
25 um
25 um
Laser Grooving
30 um
20 um
20 um
Stealth Dicing
15 um
10 um
10 um
Die Sorting
Process Roadmap
Placement Accuracy
± 30um
± 30um
± 20um
Die Size
0.15~35 μm
0.15~35 μm
0.15~45 μm
SMT
Process Roadmap
Mount Accuracy
±15 μm
± 10 μm
± 10 μm
Min. spacing between SMDs
75 μm
65 μm
55 μm
Min. SMD size
01005
008004
008004
Die Attach
Process Roadmap
Die Placement
± 3 μm
± 1.5 μm
± 1.5 μm
Minimum Die size
0.175x0.175 μm
0.150x0.150 μm
0.150x0.150 μm
Stacking
Chip on Chip
Chip on Wafer
Chip on Wafer
Wire Bond
Process Roadmap
Accuracy
± 3.5 μm
± 2.0 μm
± 2.0 μm
Wire Type
Au
Au / Al
Au / Al
Min Loop Height
80 μm
70 μm
70 μm
Active Alignment
Process Roadmap
Coupling Accuracy
0.05 μm
0.05 μm
0.03 μm
X/Y/Z-axis Repeatability
0.1mm
0.1mm
0.06mm
Thermal Compression Bonding
Process Roadmap
Bonding Accuracy
± 2.0 μm @ 3s
± 2.0 μm @ 3s
± 1.0 μm @ 3s
Heat Ramp
130C/s
200C/s
200C/s
Form
C2S
C2S & C2W
C2S & C2W
Ball Mounting
Process Roadmap
Process Roadmap
Ball Diameter
150um Ball
150um Ball
100um Ball
Ball Pitch
300um
300um
200um
Mounting target
Ball on Unit
Ball on Unit
Ball on Wafer
Product Experience

Wafer Level

Q3’2026 Ready
Bumping
Bumping
  • 8” & 12” Wafer
  • Solder Bump
  • Copper Pillar
  • RDL
Wafer Level
Q4’2025 Ready
Wafer Probing
Wafer Probing
  • SiPh Wafer Level Test
  • Automatic Fiber Alignment
Wafer Level
Wafer Grinding
Wafer Level
  • 8” & 12” Silicon Wafer
  • Non-bumped: Min 50um
  • Bumped: Min 110um
  • Auto Frame Mounting
Wafer Level
Wafer AOI
Wafer Level
  • 2D & 3D Inspection
  • Min Defect Size 1.56um
  • Incoming and Post Dicing
Wafer Level
Chip on Wafer
Wafer Level
  • +/-3um Accuracy
  • Flux Dipping
  • Laser Soldering
Wafer Level
Laser Grooving
Wafer Level
  • Low K Wafer
  • Groove Width 60um
Wafer Level
Wafer Recon
Wafer Level
  • +/-30um Accuracy
  • Hoop Ring/Gel Pak
  • 6 sides AOI
  • Min Defect Size 15um
Wafer Level
Stealth Dicing
Wafer Level
  • SiPH Stealth Dicing
  • Back Side Through Tape
  • +/-3um Dicing Accuracy

Product Experience–OIO/CPO

Receptacle Attach
OIO/CPO
  • Passive Attach
  • +/-5um Accuracy
  • Enable Detachable FAU
OIO/CPO
Optical Alignment
OIO/CPO
  • Multi CH Lens
  • Post Cure Power
    Measurement
Wafer Level
AOI
OIO/CPO
  • 6 Sides Inspection
  • 5um min defect size
  • BIN sorting
Wafer Level
OE Test
OIO/CPO
  • FAU Coupling
  • Fine Pitch Socket
  • High Speed Test
  • KGD
Wafer Level
SiPh Attach
SiPh Attach
  • +/-3um Accuracy
  • TCCUF/TCNCP
  • F/C & Mass Reflow
  • 3D Xray
Wafer Level
O/S Test
O/S Test
  • In-house developed
  • Resistance test
  • Current test
Wafer Level
Ball Attach
Ball Attach
  • Min ball size 200um
  • Solder/Flux Printing
  • Stencil Ball Drop
Wafer Level
Underfill
Underfill
  • Precision Jetting
  • Pressure Curing
  • <300um bleedout

Datacenter Transceiver

SMT
SMT
  • Smallest Chip 008004
  • Stepped Stencil
  • Solder Paste Inspection
Wafer Level
Reflow
Reflow
  • 13 heated zone
  • N2 Reflow
  • Min. O2 content 50ppm
Wafer Level
Die Attach
Die Attach
  • +/-3um Accuracy
  • Vcsel & PIN attach
  • PIC and PD attach
Wafer Level
Flux Cleaning
Flux Cleaning
  • Saponifier with DI water
  • Belt speed control
  • 25um gap cleaning
Wafer Level
Wire Bonding
Wire Bonding
  • 0.8mil & 1mil Au Wire
  • +/-3.5um Accuracy
Wafer Level
Active Alignment
Active Alignment
  • Single CH Lens
  • Multi CH Lens
  • Multi CH FAU
Wafer Level
AOI
AOI
  • Post SMT
  • Post DA/WB/AA
  • FVI
Wafer Level
Module Test
Module Test
  • DECQ
  • SMSR
  • BER

Telecom Transceiver

Eutectic Bonding
Eutectic Bonding
  • AuSn Bonding
  • +/-3um Accuracy
  • LD Bonding on AIN
COC Burn In
COC Burn In
COC Burn In
  • Customized BI Drawer
  • Customized CoC Carrier
Wafer Level
Active Alignment
WActive Alignment
  • Lens Alignment
  • AWG Alignment
Die Attach
Die Attach
Die Attach
  • +/-10um Accuracy
  • Epoxy Die Attach
  • MPD and TEC attach
Wafer Level
Seam Sealing
Seam Sealing
  • Dew point control
  • Fine leak (Helium gas)
  • Gross leak
Receptable Welding
Receptable Welding
Receptable Welding
  • 3 spots laser welding
  • Active alignment
Wafer Level
AOI
AOI
  • Post SMT
  • Post DA/WB/AA
  • FVI
Module Test
Module Test
Module Test
  • Optical Power Measurement
  • Environment Stress Test

Micro Optical Parts

Ultrasonic Cleaning
Ultrasonic Cleaning
  • High-frequency
  • Precision Cleaning
Assembly
Assembly
Assembly
  • Customized Tooling
  • Lid & V-groove Assembly
Wafer Level
AWG Coupling
AWG Coupling
  • Isolator Coupling
  • AWG Coupling
Grinding
Grinding
Grinding
  • Customized fixture
  • +/-0.5° Accuracy
Wafer Level
Stripping & Splicing
Stripping & Splicing
  • Strip to 125um cladding
  • Fiber splicing
Receptable Welding
IL & RL test
IL & RL test
  • Wavelength 800~1700nm
  • Measurement +/-0.25dB
Wafer Level
Inspection
Inspection
  • Resolution up to 1.5μm
  • Laser interferometer
    with 0.1nm precision
Function Test
Function Test
MFunction Test
  • Polarization Dependent Loss
  • Wavelength accuracy
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