- Dispensing process capability
- Location tolerance︰+/-25um
- Jet dot diameter: 0.33mm
- Jet epoxy Min.: 2.8*10-4ul
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- AOI process capability
- Resolution: 10um
- Efficiency: 0.5s/pcsm
- High efficiency auto optical inspection; 100% AOI, include missing component, shift, contamination, foreign material, lack of epoxy etc
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- DM process capability
- Multi dice mount, multi different dice/ multi different epoxy
- Die location tolerance: +/-3um~+/-10um
- Die Size︰0.17~50mm
- Die thickness︰0.08~7mm
- Stack Dice capability
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- AOI process capability
- Resolution: 3.5um
- Efficiency: 0.5s/pcs
- High efficiency auto optical inspection; 100% AOI, include missing component, shift, contamination, foreign material, lack of epoxy etc
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- Wire Bond process capability
- Wire pitch:35um
- Wire bond tolerance: +/-2um
- Supper low loop
- High efficiency auto optical inspection; 100% AOI, include missing wire, wire lift, wire sweep, etc.
- Wire bond on stacked dice
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- AOI process capability
- Resolution: 20um
- Efficiency: 1.5s/pcs
- High efficiency auto optical inspection; 100% AOI, include missing wire, wire bent, wire broken, ball oversize, wire shorted, wrong wire, ball shift, lifted ball
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- Eutectic Bonding Process Capability
- Die Placement Accuracy︰+/-3um
- Die Size︰0.2-50mm
- Die Thickness︰0.05-3mm
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