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． Wafer Process
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． Ball Mounting
->RA & FA
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->Test Overview
->Test Capability
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Ball Mounting
  • Ball Mounting Process Capability
    • Working Area︰Substrate Width 25-85mm, · Substrate Length 150-300mm
    • Placement Area︰75*290mm
    • Ball Count︰40000
    • Solder Ball Size ：0.15mm
    • Solder Ball Pitch ：0.3mm
 BallMounting
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