NPI Service and Capability
Gap Analysis
- Optical Engine 3D structure analysis
- Flip chip Bump Size & Pitch, SMT Component Spacing
- DA Die to Die Spacing, WB Bond Pad Pitch & Bond Pad Opening
Tooling Preparation & Customized Automation Solutions
- Low touch from the customer
- Tooling design and fabrication for SMT, FC, DA, WB, TCB, AA etc
- Customized Automation Solutions for AOI & Assembly
Material Preparation
- Epoxy recommendation
- Materials procurement (Passive, Epoxy, Optical components)
- Materials import
Product Traceability Setup
- SKU setup in Shop floor system
- Traceability such as Material Lot, Equipment#, Operator, MSID etc
New Process Development
- Develop new process and define WI and inspection criteria
- Conduct DOE to find out optimal process parameters