NPI服务与能力
Gap Analysis
- Optical Engine 3D structure analysis
- Flip chip Bump Size & Pitch, SMT Component Spacing
- DA Die to Die Spacing, WB Bond Pad Pitch & Bond Pad Opening
Tooling Preparation & Customized Automation Solutions
- Low touch from the customer
- Tooling design and fabrication for SMT, FC, DA, WB, TCB, AA etc
- Customized Automation Solutions for AOI & Assembly
Material Preparation
- Epoxy recommendation
- Materials procurement (Passive, Epoxy, Optical components)
- Materials import
Product Traceability Setup
- SKU setup in Shop floor system
- Traceability such as Material Lot, Equipment#, Operator, MSID etc
New Process Development
- Develop new process and define WI and inspection criteria
- Conduct DOE to find out optimal process parameters
公司地址：广东中山市火炬开发区建业东路9号之一1栋 电话：+86-760-23381689 传真：+86-760-23382117
© Copyright 2020-2021 讯芸电子科技(中山)有限公司版权所有 | 請使用IE8以上浏览器查看本网站(包括IE8)