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Process Flow Of COB Products
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- Chip on board is a form of packaging that directly bonds the chip on the PCB board.
The optoelectronic chip is bonded directly to the board with silver-containing epoxy resin adhesive.
The circuit is connected by wire bonding and sealed with epoxy resin adhesive or silicone resin top drip.
- The COB transceiver uses chip-on-board technology to connect the laser and receiver to the PCB directly.
The figure shows a typical COB optical components appearance.
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