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Process Flow Of CPO Products
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- Co-Packaged Optics (CPO) technology is designed to enable more extensive scale and faster integration
by placing the electro-optical conversion process as close as possible to the computing, switching,
or ASIC chip to achieve higher bandwidth and energy efficiency. The active device and the optical
transceiver are mounted on the same substrate, eliminating all losses and distortions caused by copper
wires on the motherboard. The electrical signal from the chip is converted to an optical signal by an
optoelectronic integrated circuit (PIC) (also called an optical chip) located at the periphery of
the substrate and coupled to an optical fiber. These fibers are terminated to high-density optical connectors
that can be mounted on I/O panels.
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